Faster transseptal puncture (TSP) and PASCAL™ Implant release
The VersaCross™ RF Wire-based workflow enabled faster TSP and faster time to first PASCAL Implant deployment, with fewer exchanges required to streamline mitral transcatheter edge-to-edge repair (M-TEER) procedures, compared to a standard mechanical needle-based workflow.
Key takeaways
Achieved 2.2x faster TSP time
Observed 1.6x faster time to first PASCAL Implant release
More precise crossing achieved due to reduction of force needed to tent the septum prior to TSP
Improved M-TEER procedural efficiency by reducing the number of wires and wire exchanges
Compared to a standard mechanical needle-based workflow, the RF wire-based transseptal workflow of the VersaCross Access Solution resulted in:
2.2x faster time from femoral access to TSP
1.6x faster time from femoral access to first PASCAL Implant release
Transseptal reimagined.
More about this study
Products in this study
VersaCross Access Solution
References:
Doshi, S. N., et al. (2023). VersaCross Transseptal System for Mitral Transcatheter Edge-To-Edge Repair with the PASCAL Repair Platform. Structural Heart, 100203.
* Continuous data are presented as median and interquartile range (IQR).
The PASCAL Implant is part of the PASCAL Precision™ Transcatheter Valve Repair System.
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